Ceramic Lapping Discs
This product series is primarily used for the carving, thinning, shaping, beveling, and polishing of gemstones, ceramics, and crystals.The main products include grinding discs, files, grinding plates, and resin discs.
Currently, grinding semiconductor silicon wafers using ceramic grinding discs is the most superior and cutting-edge grinding method. The cut silicon wafers are ground using a double-sided grinding process. The quality of the ground wafers is improved by optimizing the grinding process (grinding disc material, grinding fluid, grinding pressure, and grinding speed, etc.). In particular, using ceramic discs instead of cast iron discs avoids scratches or contamination on the main surface of the wafer during grinding, reduces the introduction of metal ions, reduces the amount of subsequent processing required for the silicon wafer, shortens the subsequent process (etching) time, improves production efficiency, and reduces silicon wafer processing losses, significantly increasing the utilization rate of silicon wafers.
Ufility:used forreducing the gem thickness.
Specification:consisting of metal bond and vitrified athegrit size
ranges 350# 600# andthe disc diameter ofo400mm-0960mm.
Feafures: high machining efficiency, and good flatness of machined products.
Physical indicators
| Performance | ZG Ceramics | Domestic level | International standards |
| Density(g/cm3) | 3.97 | 3.81-3.93 | 3.9-3.94 |
| Purity(%) | 99.9 | 98-99.8 | 99.5-99.9 |
| Vickers hardness(GPa) | 17 | 14-15 | 16-17.5 |
| Three-point bending strength | 520 | 300-350 | 330-400 |
Product Tags:
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Ceramic Lapping Discs for High Machining Efficiency and Good Flatness in Double-Sided Grinding Images
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